KOTEL - TR18 Elektroniikan lämpösuunnittelu

KOTEL TR 18 Elektroniikan lämpösuunnittelu - Thermal Design of Electronics
TR18 aloitussivu TR 18 Toiminta-ajatus ja tavoitteet
Ajankohtaista WWW-links, happenings, material
Työryhmän jäsenet Työryhmän lisäjäsenet

Conferences, seminars, meetings

Conferences in near future

A good list of current happenings is available from pages of ElectronicsCooling.

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Conference organizations

The European Solid-State Circuit Conference (ESSCIRC) and the European Solid-State Device Research Conference (ESSDERC) have conference 2005 in Grenoble, September, 12-16th 2005!

ITTF aktiviteter. ITTF (IT-industriens teknologiforum) er en samarbeidsarena for teknologisamarbeid i IT-industrien. Målet er å få industri, forskningsinstitutter og universiteter/høyskoler til å samarbeide for å styrke medlemsbedriftenes konkurranseevne.

IMAPS Nordic is the Nordic chapter of IMAPS, the International Microelectronics And Packaging Society, a non-profit society for companies and institutions involved in electronics packaging and production. The society is committed to the spreading of knowledge and information in its field. This is achieved through distribution of relevant publications, such as Advancing Microelectronics and Microelectronics International to its members, but most of all through the IMAPS Nordic Annual Conference which is held in mid-September in Denmark, Norway, Sweden, and Finland on a rotating schedule. See the conference listing.

International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES). These two conferences are held concurrently every two years. Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and documentation of the state-of-the-art in thermophysical properties. The proceedings are published in hardback format following the conference and a rigorous peer review.

MQS Network The MQS Network is a cooperation among Finland, Norway, Sweden and Denmark with a goal of contributing to increase competitive skills for members through competence development and increased cooperation focusing on printed circuit boards. The yearly conference, MQS Nordic Days, is an important activity in these ambitions. MQS skall bidraga till kompetensutveckling och utökat samarbete inom elektronikindustrin i Norden med fokus på mönsterkort.

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Recent events/ Äskettäin pidettyjä tapahtumia

IMAPS October 24 – 26, 2005 Advanced Technology Workshop on Thermal Management. Dinah's Garden Hotel,Palo Alto, California USA. Call for abstracts ends on July 15, 2005 or pdf file Call for abstracts.

Syksyn 2005 suurtapahtuma elektroniikka-alalla oli ELMO-teknologiaohjelman järjestämä businesshenkinen näyttely- ja seminaaritilaisuus 8.11.2005 ELMO RESULTS PROMOTION. Tilaisuudessa arvioitiin mihin yli 125 miljoonan euron panostus elektroniikan osaamispohjan laajentamiseen on johtanut. Monipuolinen katsaus toteutettiin rinnakkaisissa seminaarisessioissa.

2nd European Weathering Symposium EWS June 15 till 17, 2005 Gothenburg, Sweden
organized by European Weathering Symposium EWS
Main topics 2005: Weathering of Polymeric Products:
Plastics and Coatings
Determination and Simulation of Relevant Climatic Quantities
New Test Procedures and Devices
Weathering Reference Materials
Analysis of Polymer Degradation
Service Life Time Prediction

Therminic 2004 Workshop Thermal investigations of ICs on 29 September - 1 October 2004, Sophia Antipolis, Côte d'Azur, France
THERMINIC Workshops (hosted by TIMA Laboratory) are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.

Fifth Eurosime conference, which has been in Brussels from May 9-12, 2004. This unique conference deals with thermal and thermo-mechanical simulations and experiments in microelectronics and microsystems.
Full program is available here.

T W E N T I E T H Semitherm A N N U A L Semiconductor Thermal Measurement and Management Symposium and Exposition, March 7–11, 2004, Fairmont Hotel San Jose, CA, Final Program

Sensor Products Inc. - Heat Sink Seminar - January 15 and 16, 2004, Thermal Design and Analysis for Electronics January 14-15, 2004, was developed to educate engineers and technicians about all conventional and cutting-edge aspects of thermal management design and analysis for electronic systems. In addition to important cooling topics such as heat transfer principals, this course covers the physics of heat sinks and heat transfer, power trends, environmental stress testing, fan placement and design, heat pipe strategies, and temperature and air velocity measurement techniques. Also explored are such fundamental topics as predicting and classifying thermal failures, and the influence of environmental temperature. Finally, a new proprietary analytical tool used to effectively determine optimal cooling solutions is discussed.

POLYTRONIC 2003 20-23- October 2003
3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. HOTEL EDEN AU LAC - MONTREUX - SWITZERLAND

IMAPS Nordic Conference 2003 Dipoli Congress Center, Espoo, Finland 21 - 24 September 2003
IMAPS Nordic

9th International Workshop on Thermal investigations of ICs and Systems, Time: 24-26 September 2003, Aix-en-Provence, France.

EMPC 2003 14th European Microelectronics and Packaging Conference in Friedrichshafen June 23-25, 2003.
IMAPS Germany

March 11-13, 2003 19th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (program) (SEMI-THERM) Fairmont Hotel San Jose, CA

KOTELin työpaja " Lämpöä siirtävien materiaalien käyttö elektroniikassa"
22...23.1.2002 Tuusulan Gustavelundissa .
Hotellin kotisivu.

Updated August 23, 2006